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Features
This machine can be assemble to waffle making machine. It can cut the double layer or three layer wafer biscuit into small rectangular or square, and the finished wafer biscuit will be regular, well-distribute and clearly cut-side. This machine is used with wafer biscuit product line. The machine design ,easy to use, easy to operate, and are welcomed by users welcome!
This machine can cut double-deck or three-deck wafer biscuit with filling into small rectangle or square shape. One set of this machine can be coordinated wok with 4 set of wafer biscuit making machines.
This machine is simple structure, convenient operation and easy to clean.
Technical Data
| Model | LG-7 |
| the max size of wafer | 465 mm*320mm |
| Component materials in contact with food | 304 stainless steel or PU |
| Voltage 3-phase | 380V ,50 Hz |
| Dimension | 2200*1300*850mm |
| Weight | 500kg |
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