Products

Electric Type Wafer Processing Line

  • MOQ:1 /Sets
  • Brand:Longer Machinery
  • Certification:CE
  • Supply Ability:100 Sets Per Month
  • Pay Method:WEST UNION L/C T/T CASH
  • Warranty Time:12 Months
  • Loading Port:Qingdao port
  • Country Of Origin:China
Features
Adopting hearing-medium conduction technology with heating oil as medium,the plant is a new generation product developed exclusively in China based on the advanced structure of existing plants from domestic market and abroad.If offers an ideal solution for lower power consumption and overall production  cost,and keeping the same surface color for all biscuits.The plant mainly consists of mixing system,automatic feeding system, tunnel-type oven, sheet feeding and cooling device,coating machine,cutter and organic heating medium boiler, etc.With compact structure and unique reliability, the plant is one of the most preferred equipment in foodstuff industry.
Advantages
1.The blender machine is the mixing system, the first technology processing equipment in wafer manufacturing. It adopts the separate delivery and automatic circulation system.
2.As to the most important part:Baking oven.Unanimous heat colors of wafer block. Thanks to the scientific selection of heating components, superior material selection for baking plate and reasonable die carrier structure, the heat colors of the center and periphery of the wafer block having been baked are unanimous.
3.High rate of certified products with finished product rate of not less than 98%. Because of uniform heating and unanimous heat colors, the demoulding rate of biscuit is high with improving rate of certified products accordingly. 
Technical Data

Main Products:
No. name quantity
1 15 moulds flat automatic electric heating oven 1
2 Splicing machine 1
3 Wafer sheet cooling machine 1
4 Cream spreading machine 1
5 Wafer cutting machine 1
6 Blender Machine 1
7 Cream mixer 1
8 Swashing Machine 1
9 Sugar grinder 1
10 Air compressor 1

Main parameters of Wafer Biscuit Baking Oven:
Model LGDL-15-1
Moulds quantity  15
Moulds size  470*325*25mm 
Size of wafer stripe 3.0*3.0*0.5
Wafer thickness 2.0-3.0mm
Baking time 95~120 seconds(the thickness of wafer<2.5mm)
Capacity 560 pieces/h(the thickness of wafer:2.3mm)
Component materials in contact with food  304 # stainless steel or cast iron
Average Power 1.5kw
Voltage 3-phase,380V,50 Hz
Gas consumption  About 40m3/h
Dimension 3260*1560*2320mm
Weight 5700kg
 
Message
validate